<http://id.loc.gov/authorities/subjects/sh85084821> <http://www.w3.org/1999/02/22-rdf-syntax-ns#type> <http://www.loc.gov/mads/rdf/v1#Topic> .
<http://id.loc.gov/authorities/subjects/sh85084821> <http://www.w3.org/1999/02/22-rdf-syntax-ns#type> <http://www.loc.gov/mads/rdf/v1#Authority> .
<http://id.loc.gov/authorities/subjects/sh85084821> <http://www.loc.gov/mads/rdf/v1#authoritativeLabel> "Microelectronic packaging"@en .
<http://id.loc.gov/authorities/subjects/sh85084821> <http://www.loc.gov/mads/rdf/v1#elementList> _:b7iddOtlocdOtgovauthoritiessubjectssh85084821 .
_:b7iddOtlocdOtgovauthoritiessubjectssh85084821 <http://www.w3.org/1999/02/22-rdf-syntax-ns#first> _:b8iddOtlocdOtgovauthoritiessubjectssh85084821 .
_:b7iddOtlocdOtgovauthoritiessubjectssh85084821 <http://www.w3.org/1999/02/22-rdf-syntax-ns#rest> <http://www.w3.org/1999/02/22-rdf-syntax-ns#nil> .
_:b8iddOtlocdOtgovauthoritiessubjectssh85084821 <http://www.w3.org/1999/02/22-rdf-syntax-ns#type> <http://www.loc.gov/mads/rdf/v1#TopicElement> .
_:b8iddOtlocdOtgovauthoritiessubjectssh85084821 <http://www.loc.gov/mads/rdf/v1#elementValue> "Microelectronic packaging"@en .
<http://id.loc.gov/authorities/subjects/sh85084821> <http://www.loc.gov/mads/rdf/v1#hasVariant> _:b11iddOtlocdOtgovauthoritiessubjectssh85084821 .
_:b11iddOtlocdOtgovauthoritiessubjectssh85084821 <http://www.w3.org/1999/02/22-rdf-syntax-ns#type> <http://www.loc.gov/mads/rdf/v1#Topic> .
_:b11iddOtlocdOtgovauthoritiessubjectssh85084821 <http://www.w3.org/1999/02/22-rdf-syntax-ns#type> <http://www.loc.gov/mads/rdf/v1#Variant> .
_:b11iddOtlocdOtgovauthoritiessubjectssh85084821 <http://www.loc.gov/mads/rdf/v1#variantLabel> "Packaging (Microelectronics)"@en .
_:b11iddOtlocdOtgovauthoritiessubjectssh85084821 <http://www.loc.gov/mads/rdf/v1#elementList> _:b16iddOtlocdOtgovauthoritiessubjectssh85084821 .
_:b16iddOtlocdOtgovauthoritiessubjectssh85084821 <http://www.w3.org/1999/02/22-rdf-syntax-ns#first> _:b17iddOtlocdOtgovauthoritiessubjectssh85084821 .
_:b16iddOtlocdOtgovauthoritiessubjectssh85084821 <http://www.w3.org/1999/02/22-rdf-syntax-ns#rest> <http://www.w3.org/1999/02/22-rdf-syntax-ns#nil> .
_:b17iddOtlocdOtgovauthoritiessubjectssh85084821 <http://www.w3.org/1999/02/22-rdf-syntax-ns#type> <http://www.loc.gov/mads/rdf/v1#TopicElement> .
_:b17iddOtlocdOtgovauthoritiessubjectssh85084821 <http://www.loc.gov/mads/rdf/v1#elementValue> "Packaging (Microelectronics)"@en .
<http://id.loc.gov/authorities/subjects/sh85084821> <http://id.loc.gov/ontologies/bflc/marcKey> "150 $aMicroelectronic packaging" .
<http://id.loc.gov/authorities/subjects/sh85084821> <http://www.loc.gov/mads/rdf/v1#hasNarrowerAuthority> <http://id.loc.gov/authorities/subjects/sh92002333> .
<http://id.loc.gov/authorities/subjects/sh92002333> <http://www.w3.org/1999/02/22-rdf-syntax-ns#type> <http://www.loc.gov/mads/rdf/v1#Authority> .
<http://id.loc.gov/authorities/subjects/sh92002333> <http://www.loc.gov/mads/rdf/v1#authoritativeLabel> "Multichip modules (Microelectronics)"@en .
<http://id.loc.gov/authorities/subjects/sh85084821> <http://www.loc.gov/mads/rdf/v1#hasCloseExternalAuthority> <http://data.bnf.fr/ark:/12148/cb124308557> .
<http://data.bnf.fr/ark:/12148/cb124308557> <http://www.w3.org/1999/02/22-rdf-syntax-ns#type> <http://www.loc.gov/mads/rdf/v1#Authority> .
<http://data.bnf.fr/ark:/12148/cb124308557> <http://www.loc.gov/mads/rdf/v1#authoritativeLabel> "Mise sous boîtier (microélectronique)"@fr .
<http://id.loc.gov/authorities/subjects/sh85084821> <http://www.loc.gov/mads/rdf/v1#hasNarrowerExternalAuthority> <http://id.worldcat.org/fast/1019756> .
<http://id.worldcat.org/fast/1019756> <http://www.w3.org/1999/02/22-rdf-syntax-ns#type> <http://www.loc.gov/mads/rdf/v1#Authority> .
<http://id.worldcat.org/fast/1019756> <http://www.loc.gov/mads/rdf/v1#authoritativeLabel> "Microelectronic packaging--Reliability" .
<http://id.loc.gov/authorities/subjects/sh85084821> <http://www.loc.gov/mads/rdf/v1#hasCloseExternalAuthority> <https://d-nb.info/gnd/4206597-5> .
<https://d-nb.info/gnd/4206597-5> <http://www.w3.org/1999/02/22-rdf-syntax-ns#type> <http://www.loc.gov/mads/rdf/v1#Authority> .
<https://d-nb.info/gnd/4206597-5> <http://www.loc.gov/mads/rdf/v1#authoritativeLabel> "Mikrofügen" .
<http://id.loc.gov/authorities/subjects/sh85084821> <http://www.loc.gov/mads/rdf/v1#hasNarrowerExternalAuthority> <http://id.worldcat.org/fast/1019755> .
<http://id.worldcat.org/fast/1019755> <http://www.w3.org/1999/02/22-rdf-syntax-ns#type> <http://www.loc.gov/mads/rdf/v1#Authority> .
<http://id.worldcat.org/fast/1019755> <http://www.loc.gov/mads/rdf/v1#authoritativeLabel> "Microelectronic packaging--Mathematical models" .
<http://id.loc.gov/authorities/subjects/sh85084821> <http://www.loc.gov/mads/rdf/v1#hasCloseExternalAuthority> <https://d-nb.info/gnd/4143472-9> .
<https://d-nb.info/gnd/4143472-9> <http://www.w3.org/1999/02/22-rdf-syntax-ns#type> <http://www.loc.gov/mads/rdf/v1#Authority> .
<https://d-nb.info/gnd/4143472-9> <http://www.loc.gov/mads/rdf/v1#authoritativeLabel> "Halbleitergehäuse" .
<http://id.loc.gov/authorities/subjects/sh85084821> <http://www.loc.gov/mads/rdf/v1#hasBroaderAuthority> <http://id.loc.gov/authorities/subjects/sh85084822> .
<http://id.loc.gov/authorities/subjects/sh85084822> <http://www.w3.org/1999/02/22-rdf-syntax-ns#type> <http://www.loc.gov/mads/rdf/v1#Topic> .
<http://id.loc.gov/authorities/subjects/sh85084822> <http://www.w3.org/1999/02/22-rdf-syntax-ns#type> <http://www.loc.gov/mads/rdf/v1#Authority> .
<http://id.loc.gov/authorities/subjects/sh85084822> <http://www.loc.gov/mads/rdf/v1#authoritativeLabel> "Microelectronics"@en .
<http://id.loc.gov/authorities/subjects/sh85084822> <http://www.loc.gov/mads/rdf/v1#elementList> _:b51iddOtlocdOtgovauthoritiessubjectssh85084821 .
_:b51iddOtlocdOtgovauthoritiessubjectssh85084821 <http://www.w3.org/1999/02/22-rdf-syntax-ns#first> _:b52iddOtlocdOtgovauthoritiessubjectssh85084821 .
_:b51iddOtlocdOtgovauthoritiessubjectssh85084821 <http://www.w3.org/1999/02/22-rdf-syntax-ns#rest> <http://www.w3.org/1999/02/22-rdf-syntax-ns#nil> .
_:b52iddOtlocdOtgovauthoritiessubjectssh85084821 <http://www.w3.org/1999/02/22-rdf-syntax-ns#type> <http://www.loc.gov/mads/rdf/v1#TopicElement> .
_:b52iddOtlocdOtgovauthoritiessubjectssh85084821 <http://www.loc.gov/mads/rdf/v1#elementValue> "Microelectronics"@en .
<http://id.loc.gov/authorities/subjects/sh85084821> <http://www.loc.gov/mads/rdf/v1#hasNarrowerExternalAuthority> <http://id.worldcat.org/fast/1019752> .
<http://id.worldcat.org/fast/1019752> <http://www.w3.org/1999/02/22-rdf-syntax-ns#type> <http://www.loc.gov/mads/rdf/v1#Authority> .
<http://id.worldcat.org/fast/1019752> <http://www.loc.gov/mads/rdf/v1#authoritativeLabel> "Microelectronic packaging--Costs" .
<http://id.loc.gov/authorities/subjects/sh85084821> <http://www.loc.gov/mads/rdf/v1#hasCloseExternalAuthority> <http://www.wikidata.org/entity/Q17152858> .
<http://www.wikidata.org/entity/Q17152858> <http://www.w3.org/1999/02/22-rdf-syntax-ns#type> <http://www.loc.gov/mads/rdf/v1#Authority> .
<http://www.wikidata.org/entity/Q17152858> <http://www.loc.gov/mads/rdf/v1#authoritativeLabel> "semiconductor package" .
<http://id.loc.gov/authorities/subjects/sh85084821> <http://www.loc.gov/mads/rdf/v1#hasBroaderAuthority> <http://id.loc.gov/authorities/subjects/sh85042366> .
<http://id.loc.gov/authorities/subjects/sh85042366> <http://www.w3.org/1999/02/22-rdf-syntax-ns#type> <http://www.loc.gov/mads/rdf/v1#Topic> .
<http://id.loc.gov/authorities/subjects/sh85042366> <http://www.w3.org/1999/02/22-rdf-syntax-ns#type> <http://www.loc.gov/mads/rdf/v1#Authority> .
<http://id.loc.gov/authorities/subjects/sh85042366> <http://www.loc.gov/mads/rdf/v1#authoritativeLabel> "Electronic packaging"@en .
<http://id.loc.gov/authorities/subjects/sh85042366> <http://www.loc.gov/mads/rdf/v1#elementList> _:b68iddOtlocdOtgovauthoritiessubjectssh85084821 .
_:b68iddOtlocdOtgovauthoritiessubjectssh85084821 <http://www.w3.org/1999/02/22-rdf-syntax-ns#first> _:b69iddOtlocdOtgovauthoritiessubjectssh85084821 .
_:b68iddOtlocdOtgovauthoritiessubjectssh85084821 <http://www.w3.org/1999/02/22-rdf-syntax-ns#rest> <http://www.w3.org/1999/02/22-rdf-syntax-ns#nil> .
_:b69iddOtlocdOtgovauthoritiessubjectssh85084821 <http://www.w3.org/1999/02/22-rdf-syntax-ns#type> <http://www.loc.gov/mads/rdf/v1#TopicElement> .
_:b69iddOtlocdOtgovauthoritiessubjectssh85084821 <http://www.loc.gov/mads/rdf/v1#elementValue> "Electronic packaging"@en .
<http://id.loc.gov/authorities/subjects/sh85084821> <http://www.loc.gov/mads/rdf/v1#hasNarrowerExternalAuthority> <http://id.worldcat.org/fast/1019754> .
<http://id.worldcat.org/fast/1019754> <http://www.w3.org/1999/02/22-rdf-syntax-ns#type> <http://www.loc.gov/mads/rdf/v1#Authority> .
<http://id.worldcat.org/fast/1019754> <http://www.loc.gov/mads/rdf/v1#authoritativeLabel> "Microelectronic packaging--Materials" .
<http://id.loc.gov/authorities/subjects/sh85084821> <http://www.loc.gov/mads/rdf/v1#hasCloseExternalAuthority> <http://id.worldcat.org/fast/1019751> .
<http://id.worldcat.org/fast/1019751> <http://www.w3.org/1999/02/22-rdf-syntax-ns#type> <http://www.loc.gov/mads/rdf/v1#Authority> .
<http://id.worldcat.org/fast/1019751> <http://www.loc.gov/mads/rdf/v1#authoritativeLabel> "Microelectronic packaging" .
<http://id.loc.gov/authorities/subjects/sh85084821> <http://www.loc.gov/mads/rdf/v1#hasNarrowerExternalAuthority> <http://id.worldcat.org/fast/1019753> .
<http://id.worldcat.org/fast/1019753> <http://www.w3.org/1999/02/22-rdf-syntax-ns#type> <http://www.loc.gov/mads/rdf/v1#Authority> .
<http://id.worldcat.org/fast/1019753> <http://www.loc.gov/mads/rdf/v1#authoritativeLabel> "Microelectronic packaging--Design and construction" .
<http://id.loc.gov/authorities/subjects/sh85084821> <http://www.loc.gov/mads/rdf/v1#isMemberOfMADSCollection> <http://id.loc.gov/authorities/subjects/collection_LCSHAuthorizedHeadings> .
<http://id.loc.gov/authorities/subjects/sh85084821> <http://www.loc.gov/mads/rdf/v1#isMemberOfMADSCollection> <http://id.loc.gov/authorities/subjects/collection_LCSH_General> .
<http://id.loc.gov/authorities/subjects/sh85084821> <http://id.loc.gov/ontologies/bflc/subjectOf> <http://id.loc.gov/resources/works/16751543> .
<http://id.loc.gov/resources/works/16751543> <http://www.w3.org/1999/02/22-rdf-syntax-ns#type> <http://id.loc.gov/ontologies/bibframe/Work> .
<http://id.loc.gov/resources/works/16751543> <http://id.loc.gov/ontologies/bflc/aap> "3D IC stacking technology" .
<http://id.loc.gov/authorities/subjects/sh85084821> <http://id.loc.gov/ontologies/bflc/subjectOf> <http://id.loc.gov/resources/works/22427885> .
<http://id.loc.gov/resources/works/22427885> <http://www.w3.org/1999/02/22-rdf-syntax-ns#type> <http://id.loc.gov/ontologies/bibframe/Work> .
<http://id.loc.gov/resources/works/22427885> <http://id.loc.gov/ontologies/bflc/aap> "3D IC stacking technology" .
<http://id.loc.gov/authorities/subjects/sh85084821> <http://id.loc.gov/ontologies/bflc/subjectOf> <http://id.loc.gov/resources/works/1199254> .
<http://id.loc.gov/resources/works/1199254> <http://www.w3.org/1999/02/22-rdf-syntax-ns#type> <http://id.loc.gov/ontologies/bibframe/Work> .
<http://id.loc.gov/resources/works/1199254> <http://id.loc.gov/ontologies/bflc/aap> "Advanced electronic packaging" .
<http://id.loc.gov/authorities/subjects/sh85084821> <http://id.loc.gov/ontologies/bflc/subjectOf> <http://id.loc.gov/resources/works/14391509> .
<http://id.loc.gov/resources/works/14391509> <http://www.w3.org/1999/02/22-rdf-syntax-ns#type> <http://id.loc.gov/ontologies/bibframe/Work> .
<http://id.loc.gov/resources/works/14391509> <http://id.loc.gov/ontologies/bflc/aap> "Advanced electronic packaging" .
<http://id.loc.gov/authorities/subjects/sh85084821> <http://id.loc.gov/ontologies/bflc/subjectOf> <http://id.loc.gov/resources/works/15956240> .
<http://id.loc.gov/resources/works/15956240> <http://www.w3.org/1999/02/22-rdf-syntax-ns#type> <http://id.loc.gov/ontologies/bibframe/Work> .
<http://id.loc.gov/resources/works/15956240> <http://id.loc.gov/ontologies/bflc/aap> "Advanced MEMS packaging" .
<http://id.loc.gov/authorities/subjects/sh85084821> <http://id.loc.gov/ontologies/bflc/subjectOf> <http://id.loc.gov/resources/works/22340300> .
<http://id.loc.gov/resources/works/22340300> <http://www.w3.org/1999/02/22-rdf-syntax-ns#type> <http://id.loc.gov/ontologies/bibframe/Work> .
<http://id.loc.gov/resources/works/22340300> <http://id.loc.gov/ontologies/bflc/aap> "Advanced MEMS packaging" .
<http://id.loc.gov/authorities/subjects/sh85084821> <http://id.loc.gov/ontologies/bflc/subjectOf> <http://id.loc.gov/resources/works/21335827> .
<http://id.loc.gov/resources/works/21335827> <http://www.w3.org/1999/02/22-rdf-syntax-ns#type> <http://id.loc.gov/ontologies/bibframe/Work> .
<http://id.loc.gov/resources/works/21335827> <http://id.loc.gov/ontologies/bflc/aap> "Antenna-in-package technology and applications" .
<http://id.loc.gov/authorities/subjects/sh85084821> <http://id.loc.gov/ontologies/bflc/subjectOf> <http://id.loc.gov/resources/works/21425955> .
<http://id.loc.gov/resources/works/21425955> <http://www.w3.org/1999/02/22-rdf-syntax-ns#type> <http://id.loc.gov/ontologies/bibframe/Work> .
<http://id.loc.gov/resources/works/21425955> <http://id.loc.gov/ontologies/bflc/aap> "Antenna-in-package technology and applications" .
<http://id.loc.gov/authorities/subjects/sh85084821> <http://id.loc.gov/ontologies/bflc/subjectOf> <http://id.loc.gov/resources/works/13471765> .
<http://id.loc.gov/resources/works/13471765> <http://www.w3.org/1999/02/22-rdf-syntax-ns#type> <http://id.loc.gov/ontologies/bibframe/Work> .
<http://id.loc.gov/resources/works/13471765> <http://id.loc.gov/ontologies/bflc/aap> "Area array packaging processes" .
<http://id.loc.gov/authorities/subjects/sh85084821> <http://id.loc.gov/ontologies/bflc/subjectOf> <http://id.loc.gov/resources/works/21099704> .
<http://id.loc.gov/resources/works/21099704> <http://www.w3.org/1999/02/22-rdf-syntax-ns#type> <http://id.loc.gov/ontologies/bibframe/Work> .
<http://id.loc.gov/resources/works/21099704> <http://id.loc.gov/ontologies/bflc/aap> "Bio and nano packaging techniques for electron devices" .
<http://id.loc.gov/authorities/subjects/sh85084821> <http://id.loc.gov/ontologies/bflc/subjectOf> <http://id.loc.gov/resources/works/4027701> .
<http://id.loc.gov/resources/works/4027701> <http://www.w3.org/1999/02/22-rdf-syntax-ns#type> <http://id.loc.gov/ontologies/bibframe/Work> .
<http://id.loc.gov/resources/works/4027701> <http://id.loc.gov/ontologies/bflc/aap> "Bogatin, Eric Roadmaps of packaging technology" .
<http://id.loc.gov/authorities/subjects/sh85084821> <http://id.loc.gov/ontologies/bflc/subjectOf> <http://id.loc.gov/resources/works/16017551> .
<http://id.loc.gov/resources/works/16017551> <http://www.w3.org/1999/02/22-rdf-syntax-ns#type> <http://id.loc.gov/ontologies/bibframe/Work> .
<http://id.loc.gov/resources/works/16017551> <http://id.loc.gov/ontologies/bflc/aap> "Canumalla, Sridhar Portable consumer electronics" .
<http://id.loc.gov/authorities/subjects/sh85084821> <http://id.loc.gov/ontologies/bflc/subjectOf> <http://id.loc.gov/resources/works/16991604> .
<http://id.loc.gov/resources/works/16991604> <http://www.w3.org/1999/02/22-rdf-syntax-ns#type> <http://id.loc.gov/ontologies/bibframe/Work> .
<http://id.loc.gov/resources/works/16991604> <http://id.loc.gov/ontologies/bflc/aap> "Chen, Andrea Semiconductor packaging" .
<http://id.loc.gov/authorities/subjects/sh85084821> <http://id.loc.gov/ontologies/bflc/subjectOf> <http://id.loc.gov/resources/works/22456746> .
<http://id.loc.gov/resources/works/22456746> <http://www.w3.org/1999/02/22-rdf-syntax-ns#type> <http://id.loc.gov/ontologies/bibframe/Work> .
<http://id.loc.gov/resources/works/22456746> <http://id.loc.gov/ontologies/bflc/aap> "Chen, Andrea Semiconductor packaging" .
<http://id.loc.gov/authorities/subjects/sh85084821> <http://id.loc.gov/ontologies/bflc/subjectOf> <http://id.loc.gov/resources/works/18750693> .
<http://id.loc.gov/resources/works/18750693> <http://www.w3.org/1999/02/22-rdf-syntax-ns#type> <http://id.loc.gov/ontologies/bibframe/Work> .
<http://id.loc.gov/resources/works/18750693> <http://id.loc.gov/ontologies/bflc/aap> "Cheng, Yu Jian Substrate integrated antennas and arrays" .
<http://id.loc.gov/authorities/subjects/sh85084821> <http://id.loc.gov/ontologies/bflc/subjectOf> <http://id.loc.gov/resources/works/4513769> .
<http://id.loc.gov/resources/works/4513769> <http://www.w3.org/1999/02/22-rdf-syntax-ns#type> <http://id.loc.gov/ontologies/bibframe/Work> .
<http://id.loc.gov/resources/works/4513769> <http://id.loc.gov/ontologies/bflc/aap> "Chip-size packaging developments" .
<http://id.loc.gov/authorities/subjects/sh85084821> <http://id.loc.gov/ontologies/bflc/subjectOf> <http://id.loc.gov/resources/works/18152615> .
<http://id.loc.gov/resources/works/18152615> <http://www.w3.org/1999/02/22-rdf-syntax-ns#type> <http://id.loc.gov/ontologies/bibframe/Work> .
<http://id.loc.gov/resources/works/18152615> <http://id.loc.gov/ontologies/bflc/aap> "Costello, Suzanne Hermeticity testing of MEMS and microelectronic packages" .
<http://id.loc.gov/authorities/subjects/sh85084821> <http://id.loc.gov/ontologies/bflc/subjectOf> <http://id.loc.gov/resources/works/1655120> .
<http://id.loc.gov/resources/works/1655120> <http://www.w3.org/1999/02/22-rdf-syntax-ns#type> <http://id.loc.gov/ontologies/bibframe/Work> .
<http://id.loc.gov/resources/works/1655120> <http://id.loc.gov/ontologies/bflc/aap> "Directions for the next generation of MMIC devices and systems" .
<http://id.loc.gov/authorities/subjects/sh85084821> <http://id.loc.gov/ontologies/bflc/subjectOf> <http://id.loc.gov/resources/works/2815534> .
<http://id.loc.gov/resources/works/2815534> <http://www.w3.org/1999/02/22-rdf-syntax-ns#type> <http://id.loc.gov/ontologies/bibframe/Work> .
<http://id.loc.gov/resources/works/2815534> <http://id.loc.gov/ontologies/bflc/aap> "Electronic packaging strategies for the 80s" .
<http://id.loc.gov/authorities/subjects/sh85084821> <http://id.loc.gov/ontologies/bflc/subjectOf> <http://id.loc.gov/resources/works/13725422> .
<http://id.loc.gov/resources/works/13725422> <http://www.w3.org/1999/02/22-rdf-syntax-ns#type> <http://id.loc.gov/ontologies/bibframe/Work> .
<http://id.loc.gov/resources/works/13725422> <http://id.loc.gov/ontologies/bflc/aap> "Failure-free integrated circuit packages" .
<http://id.loc.gov/authorities/subjects/sh85084821> <http://id.loc.gov/ontologies/bflc/subjectOf> <http://id.loc.gov/resources/works/12932836> .
<http://id.loc.gov/resources/works/12932836> <http://www.w3.org/1999/02/22-rdf-syntax-ns#type> <http://id.loc.gov/ontologies/bibframe/Work> .
<http://id.loc.gov/resources/works/12932836> <http://id.loc.gov/ontologies/bflc/aap> "Foldable flex and thinned silicon multichip packaging technology" .
<http://id.loc.gov/authorities/subjects/sh85084821> <http://id.loc.gov/ontologies/bflc/subjectOf> <http://id.loc.gov/resources/works/21042412> .
<http://id.loc.gov/resources/works/21042412> <http://www.w3.org/1999/02/22-rdf-syntax-ns#type> <http://id.loc.gov/ontologies/bibframe/Work> .
<http://id.loc.gov/resources/works/21042412> <http://id.loc.gov/ontologies/bflc/aap> "Fundamentals of device and systems packaging" .
<http://id.loc.gov/authorities/subjects/sh85084821> <http://id.loc.gov/ontologies/bflc/subjectOf> <http://id.loc.gov/resources/works/4975752> .
<http://id.loc.gov/resources/works/4975752> <http://www.w3.org/1999/02/22-rdf-syntax-ns#type> <http://id.loc.gov/ontologies/bibframe/Work> .
<http://id.loc.gov/resources/works/4975752> <http://id.loc.gov/ontologies/bflc/aap> "Garrou, Philip E. Multichip module technology handbook" .
<http://id.loc.gov/authorities/subjects/sh85084821> <http://id.loc.gov/ontologies/bflc/subjectOf> <http://id.loc.gov/resources/works/12430236> .
<http://id.loc.gov/resources/works/12430236> <http://www.w3.org/1999/02/22-rdf-syntax-ns#type> <http://id.loc.gov/ontologies/bibframe/Work> .
<http://id.loc.gov/resources/works/12430236> <http://id.loc.gov/ontologies/bflc/aap> "Gilleo, Ken Area array packaging handbook" .
<http://id.loc.gov/authorities/subjects/sh85084821> <http://id.loc.gov/ontologies/bflc/subjectOf> <http://id.loc.gov/resources/works/13973621> .
<http://id.loc.gov/resources/works/13973621> <http://www.w3.org/1999/02/22-rdf-syntax-ns#type> <http://id.loc.gov/ontologies/bibframe/Work> .
<http://id.loc.gov/resources/works/13973621> <http://id.loc.gov/ontologies/bflc/aap> "Gilleo, Ken MEMS/MOEMS packaging" .
<http://id.loc.gov/authorities/subjects/sh85084821> <http://id.loc.gov/ontologies/bflc/subjectOf> <http://id.loc.gov/resources/works/4937679> .
<http://id.loc.gov/resources/works/4937679> <http://www.w3.org/1999/02/22-rdf-syntax-ns#type> <http://id.loc.gov/ontologies/bibframe/Work> .
<http://id.loc.gov/resources/works/4937679> <http://id.loc.gov/ontologies/bflc/aap> "Gilleo, Ken Polymer thick film" .
<http://id.loc.gov/authorities/subjects/sh85084821> <http://id.loc.gov/ontologies/bflc/subjectOf> <http://id.loc.gov/resources/works/14503114> .
<http://id.loc.gov/resources/works/14503114> <http://www.w3.org/1999/02/22-rdf-syntax-ns#type> <http://id.loc.gov/ontologies/bibframe/Work> .
<http://id.loc.gov/resources/works/14503114> <http://id.loc.gov/ontologies/bflc/aap> "Golshan, Khosrow Physical design essentials" .
<http://id.loc.gov/authorities/subjects/sh85084821> <http://id.loc.gov/ontologies/bflc/subjectOf> <http://id.loc.gov/resources/works/14376578> .
<http://id.loc.gov/resources/works/14376578> <http://www.w3.org/1999/02/22-rdf-syntax-ns#type> <http://id.loc.gov/ontologies/bibframe/Work> .
<http://id.loc.gov/resources/works/14376578> <http://id.loc.gov/ontologies/bflc/aap> "Greig, William J. Integrated circuit packaging, assembly, and interconnections" .
<http://id.loc.gov/authorities/subjects/sh85084821> <http://id.loc.gov/ontologies/bflc/subjectOf> <http://id.loc.gov/resources/works/1925707> .
<http://id.loc.gov/resources/works/1925707> <http://www.w3.org/1999/02/22-rdf-syntax-ns#type> <http://id.loc.gov/ontologies/bibframe/Work> .
<http://id.loc.gov/resources/works/1925707> <http://id.loc.gov/ontologies/bflc/aap> "Gusʹkov, G. I︠A︡. (Gennadiĭ I︠A︡kovlevich) Montazh mikroėlektronnoĭ apparatury" .
<http://id.loc.gov/authorities/subjects/sh85084821> <http://id.loc.gov/ontologies/bflc/subjectOf> <http://id.loc.gov/resources/works/12119232> .
<http://id.loc.gov/resources/works/12119232> <http://www.w3.org/1999/02/22-rdf-syntax-ns#type> <http://id.loc.gov/ontologies/bibframe/Work> .
<http://id.loc.gov/resources/works/12119232> <http://id.loc.gov/ontologies/bflc/aap> "Hirt, Etienne System design using high density packaging and multi chip modules" .
<http://id.loc.gov/authorities/subjects/sh85084821> <http://id.loc.gov/ontologies/bflc/subjectOf> <http://id.loc.gov/resources/works/12510004> .
<http://id.loc.gov/resources/works/12510004> <http://www.w3.org/1999/02/22-rdf-syntax-ns#type> <http://id.loc.gov/ontologies/bibframe/Work> .
<http://id.loc.gov/resources/works/12510004> <http://id.loc.gov/ontologies/bflc/aap> "Hsu, Tai-Ran MEMS and microsystems" .
<http://id.loc.gov/authorities/subjects/sh85084821> <http://id.loc.gov/ontologies/bflc/subjectOf> <http://id.loc.gov/resources/works/14819321> .
<http://id.loc.gov/resources/works/14819321> <http://www.w3.org/1999/02/22-rdf-syntax-ns#type> <http://id.loc.gov/ontologies/bibframe/Work> .
<http://id.loc.gov/resources/works/14819321> <http://id.loc.gov/ontologies/bflc/aap> "Hsu, Tai-Ran MEMS and microsystems" .
<http://id.loc.gov/authorities/subjects/sh85084821> <http://id.loc.gov/ontologies/bflc/subjectOf> <http://id.loc.gov/resources/works/3563455> .
<http://id.loc.gov/resources/works/3563455> <http://www.w3.org/1999/02/22-rdf-syntax-ns#type> <http://id.loc.gov/ontologies/bibframe/Work> .
<http://id.loc.gov/resources/works/3563455> <http://id.loc.gov/ontologies/bflc/aap> "Incropera, Frank P. Liquid cooling of electronic devices by single-phase convection" .
<http://id.loc.gov/authorities/subjects/sh85084821> <http://id.loc.gov/ontologies/bflc/subjectOf> <http://id.loc.gov/resources/works/3094696> .
<http://id.loc.gov/resources/works/3094696> <http://www.w3.org/1999/02/22-rdf-syntax-ns#type> <http://id.loc.gov/ontologies/bibframe/Work> .
<http://id.loc.gov/resources/works/3094696> <http://id.loc.gov/ontologies/bflc/aap> "IVF CSP project prestudy state of the industry assessment" .
<http://id.loc.gov/authorities/subjects/sh85084821> <http://id.loc.gov/ontologies/bflc/subjectOf> <http://id.loc.gov/resources/works/15988675> .
<http://id.loc.gov/resources/works/15988675> <http://www.w3.org/1999/02/22-rdf-syntax-ns#type> <http://id.loc.gov/ontologies/bibframe/Work> .
<http://id.loc.gov/resources/works/15988675> <http://id.loc.gov/ontologies/bflc/aap> "Jin, Yufeng Introduction to microsystem packaging technology" .
<http://id.loc.gov/authorities/subjects/sh85084821> <http://id.loc.gov/ontologies/bflc/subjectOf> <http://id.loc.gov/resources/works/17840787> .
<http://id.loc.gov/resources/works/17840787> <http://www.w3.org/1999/02/22-rdf-syntax-ns#type> <http://id.loc.gov/ontologies/bibframe/Work> .
<http://id.loc.gov/resources/works/17840787> <http://id.loc.gov/ontologies/bflc/aap> "Jin, Yufeng Wei mi na mi qi jian feng zhuang ji shu" .
<http://id.loc.gov/authorities/subjects/sh85084821> <http://id.loc.gov/ontologies/bflc/subjectOf> <http://id.loc.gov/resources/works/731366> .
<http://id.loc.gov/resources/works/731366> <http://www.w3.org/1999/02/22-rdf-syntax-ns#type> <http://id.loc.gov/ontologies/bibframe/Work> .
<http://id.loc.gov/resources/works/731366> <http://id.loc.gov/ontologies/bflc/aap> "Kellerman, David Prevalent single chip packages for integrated circuit packages" .
<http://id.loc.gov/authorities/subjects/sh85084821> <http://id.loc.gov/ontologies/bflc/subjectOf> <http://id.loc.gov/resources/works/4047494> .
<http://id.loc.gov/resources/works/4047494> <http://www.w3.org/1999/02/22-rdf-syntax-ns#type> <http://id.loc.gov/ontologies/bibframe/Work> .
<http://id.loc.gov/resources/works/4047494> <http://id.loc.gov/ontologies/bflc/aap> "Kelly, Gerard, Dr The simulation of thermomechanically induced stress in plastic encapsulated IC packages" .
<http://id.loc.gov/authorities/subjects/sh85084821> <http://id.loc.gov/ontologies/bflc/subjectOf> <http://id.loc.gov/resources/works/2132128> .
<http://id.loc.gov/resources/works/2132128> <http://www.w3.org/1999/02/22-rdf-syntax-ns#type> <http://id.loc.gov/ontologies/bibframe/Work> .
<http://id.loc.gov/resources/works/2132128> <http://id.loc.gov/ontologies/bflc/aap> "Knipfer, Brent J. Multichip packaging and bare chip systems" .
<http://id.loc.gov/authorities/subjects/sh85084821> <http://id.loc.gov/ontologies/bflc/subjectOf> <http://id.loc.gov/resources/works/18577969> .
<http://id.loc.gov/resources/works/18577969> <http://www.w3.org/1999/02/22-rdf-syntax-ns#type> <http://id.loc.gov/ontologies/bibframe/Work> .
<http://id.loc.gov/resources/works/18577969> <http://id.loc.gov/ontologies/bflc/aap> "Lau, John H. 3D IC integration and packaging" .
<http://id.loc.gov/authorities/subjects/sh85084821> <http://id.loc.gov/ontologies/bflc/subjectOf> <http://id.loc.gov/resources/works/22342232> .
<http://id.loc.gov/resources/works/22342232> <http://www.w3.org/1999/02/22-rdf-syntax-ns#type> <http://id.loc.gov/ontologies/bibframe/Work> .
<http://id.loc.gov/resources/works/22342232> <http://id.loc.gov/ontologies/bflc/aap> "Lau, John H. 3D IC integration and packaging" .
<http://id.loc.gov/authorities/subjects/sh85084821> <http://id.loc.gov/ontologies/bflc/subjectOf> <http://id.loc.gov/resources/works/1673343> .
<http://id.loc.gov/resources/works/1673343> <http://www.w3.org/1999/02/22-rdf-syntax-ns#type> <http://id.loc.gov/ontologies/bibframe/Work> .
<http://id.loc.gov/resources/works/1673343> <http://id.loc.gov/ontologies/bflc/aap> "Lau, John H. Chip scale package (CSP)" .
<http://id.loc.gov/authorities/subjects/sh85084821> <http://id.loc.gov/ontologies/bflc/subjectOf> <http://id.loc.gov/resources/works/12352717> .
<http://id.loc.gov/resources/works/12352717> <http://www.w3.org/1999/02/22-rdf-syntax-ns#type> <http://id.loc.gov/ontologies/bibframe/Work> .
<http://id.loc.gov/resources/works/12352717> <http://id.loc.gov/ontologies/bflc/aap> "Lau, John H. Microvias" .
<http://id.loc.gov/authorities/subjects/sh85084821> <http://id.loc.gov/ontologies/bflc/subjectOf> <http://id.loc.gov/resources/works/13483568> .
<http://id.loc.gov/resources/works/13483568> <http://www.w3.org/1999/02/22-rdf-syntax-ns#type> <http://id.loc.gov/ontologies/bibframe/Work> .
<http://id.loc.gov/resources/works/13483568> <http://id.loc.gov/ontologies/bflc/aap> "Liu, Weifeng IC component sockets" .
<http://id.loc.gov/authorities/subjects/sh85084821> <http://id.loc.gov/ontologies/bflc/subjectOf> <http://id.loc.gov/resources/works/12490201> .
<http://id.loc.gov/resources/works/12490201> <http://www.w3.org/1999/02/22-rdf-syntax-ns#type> <http://id.loc.gov/ontologies/bibframe/Work> .
<http://id.loc.gov/resources/works/12490201> <http://id.loc.gov/ontologies/bflc/aap> "Madou, Marc J. Fundamentals of microfabrication" .
<http://id.loc.gov/authorities/subjects/sh85084821> <http://id.loc.gov/ontologies/bflc/subjectOf> <http://id.loc.gov/resources/works/1636710> .
<http://id.loc.gov/resources/works/1636710> <http://www.w3.org/1999/02/22-rdf-syntax-ns#type> <http://id.loc.gov/ontologies/bibframe/Work> .
<http://id.loc.gov/resources/works/1636710> <http://id.loc.gov/ontologies/bflc/aap> "Madou, Marc J. Fundamentals of microfabrication" .
<http://id.loc.gov/authorities/subjects/sh85084821> <http://id.loc.gov/ontologies/bflc/subjectOf> <http://id.loc.gov/resources/works/17600060> .
<http://id.loc.gov/resources/works/17600060> <http://www.w3.org/1999/02/22-rdf-syntax-ns#type> <http://id.loc.gov/ontologies/bibframe/Work> .
<http://id.loc.gov/resources/works/17600060> <http://id.loc.gov/ontologies/bflc/aap> "MEMS" .
<http://id.loc.gov/authorities/subjects/sh85084821> <http://id.loc.gov/ontologies/bflc/subjectOf> <http://id.loc.gov/resources/works/15359420> .
<http://id.loc.gov/resources/works/15359420> <http://www.w3.org/1999/02/22-rdf-syntax-ns#type> <http://id.loc.gov/ontologies/bibframe/Work> .
<http://id.loc.gov/resources/works/15359420> <http://id.loc.gov/ontologies/bflc/aap> "MEMS markets" .
<http://id.loc.gov/authorities/subjects/sh85084821> <http://id.loc.gov/ontologies/bflc/subjectOf> <http://id.loc.gov/resources/works/18257084> .
<http://id.loc.gov/resources/works/18257084> <http://www.w3.org/1999/02/22-rdf-syntax-ns#type> <http://id.loc.gov/ontologies/bibframe/Work> .
<http://id.loc.gov/resources/works/18257084> <http://id.loc.gov/ontologies/bflc/aap> "MEMS packaging" .
<http://id.loc.gov/authorities/subjects/sh85084821> <http://id.loc.gov/ontologies/bflc/subjectOf> <http://id.loc.gov/resources/works/20229530> .
<http://id.loc.gov/resources/works/20229530> <http://www.w3.org/1999/02/22-rdf-syntax-ns#type> <http://id.loc.gov/ontologies/bibframe/Work> .
<http://id.loc.gov/resources/works/20229530> <http://id.loc.gov/ontologies/bflc/aap> "MEMS packaging" .
<http://id.loc.gov/authorities/subjects/sh85084821> <http://id.loc.gov/ontologies/bflc/subjectOf> <http://id.loc.gov/resources/works/13584095> .
<http://id.loc.gov/resources/works/13584095> <http://www.w3.org/1999/02/22-rdf-syntax-ns#type> <http://id.loc.gov/ontologies/bibframe/Work> .
<http://id.loc.gov/resources/works/13584095> <http://id.loc.gov/ontologies/bflc/aap> "Microelectronic packaging" .
<http://id.loc.gov/authorities/subjects/sh85084821> <http://id.loc.gov/ontologies/bflc/subjectOf> <http://id.loc.gov/resources/works/3699793> .
<http://id.loc.gov/resources/works/3699793> <http://www.w3.org/1999/02/22-rdf-syntax-ns#type> <http://id.loc.gov/ontologies/bibframe/Work> .
<http://id.loc.gov/resources/works/3699793> <http://id.loc.gov/ontologies/bflc/aap> "Microelectronics interconnection and packaging" .
<http://id.loc.gov/authorities/subjects/sh85084821> <http://id.loc.gov/ontologies/bflc/subjectOf> <http://id.loc.gov/resources/works/2032575> .
<http://id.loc.gov/resources/works/2032575> <http://www.w3.org/1999/02/22-rdf-syntax-ns#type> <http://id.loc.gov/ontologies/bibframe/Work> .
<http://id.loc.gov/resources/works/2032575> <http://id.loc.gov/ontologies/bflc/aap> "Multichip module technologies and alternatives" .
<http://id.loc.gov/authorities/subjects/sh85084821> <http://id.loc.gov/ontologies/bflc/subjectOf> <http://id.loc.gov/resources/works/2942512> .
<http://id.loc.gov/resources/works/2942512> <http://www.w3.org/1999/02/22-rdf-syntax-ns#type> <http://id.loc.gov/ontologies/bibframe/Work> .
<http://id.loc.gov/resources/works/2942512> <http://id.loc.gov/ontologies/bflc/aap> "Multichip modules" .
<http://id.loc.gov/authorities/subjects/sh85084821> <http://id.loc.gov/ontologies/bflc/subjectOf> <http://id.loc.gov/resources/works/1469440> .
<http://id.loc.gov/resources/works/1469440> <http://www.w3.org/1999/02/22-rdf-syntax-ns#type> <http://id.loc.gov/ontologies/bibframe/Work> .
<http://id.loc.gov/resources/works/1469440> <http://id.loc.gov/ontologies/bflc/aap> "Napri︠a︡zhenii︠a︡ i deformat︠s︡ii v ėlementakh mikroskhem" .
<http://id.loc.gov/authorities/subjects/sh85084821> <http://id.loc.gov/ontologies/bflc/subjectOf> <http://id.loc.gov/resources/works/3526784> .
<http://id.loc.gov/resources/works/3526784> <http://www.w3.org/1999/02/22-rdf-syntax-ns#type> <http://id.loc.gov/ontologies/bibframe/Work> .
<http://id.loc.gov/resources/works/3526784> <http://id.loc.gov/ontologies/bflc/aap> "Optoelectronic packaging" .
<http://id.loc.gov/authorities/subjects/sh85084821> <http://id.loc.gov/ontologies/bflc/subjectOf> <http://id.loc.gov/resources/works/14845324> .
<http://id.loc.gov/resources/works/14845324> <http://www.w3.org/1999/02/22-rdf-syntax-ns#type> <http://id.loc.gov/ontologies/bibframe/Work> .
<http://id.loc.gov/resources/works/14845324> <http://id.loc.gov/ontologies/bflc/aap> "Quantum-well laser array packaging" .
<http://id.loc.gov/authorities/subjects/sh85084821> <http://id.loc.gov/ontologies/bflc/subjectOf> <http://id.loc.gov/resources/works/15943788> .
<http://id.loc.gov/resources/works/15943788> <http://www.w3.org/1999/02/22-rdf-syntax-ns#type> <http://id.loc.gov/ontologies/bibframe/Work> .
<http://id.loc.gov/resources/works/15943788> <http://id.loc.gov/ontologies/bflc/aap> "RF and microwave microelectronics packaging" .
<http://id.loc.gov/authorities/subjects/sh85084821> <http://id.loc.gov/ontologies/bflc/subjectOf> <http://id.loc.gov/resources/works/13660907> .
<http://id.loc.gov/resources/works/13660907> <http://www.w3.org/1999/02/22-rdf-syntax-ns#type> <http://id.loc.gov/ontologies/bibframe/Work> .
<http://id.loc.gov/resources/works/13660907> <http://id.loc.gov/ontologies/bflc/aap> "Schwizer, Jürg Force sensors for microelectronic packaging applications" .
<http://id.loc.gov/authorities/subjects/sh85084821> <http://id.loc.gov/ontologies/bflc/subjectOf> <http://id.loc.gov/resources/works/2127166> .
<http://id.loc.gov/resources/works/2127166> <http://www.w3.org/1999/02/22-rdf-syntax-ns#type> <http://id.loc.gov/ontologies/bibframe/Work> .
<http://id.loc.gov/resources/works/2127166> <http://id.loc.gov/ontologies/bflc/aap> "Selected papers on optical interconnects and packaging" .
<http://id.loc.gov/authorities/subjects/sh85084821> <http://id.loc.gov/ontologies/bflc/subjectOf> <http://id.loc.gov/resources/works/2644983> .
<http://id.loc.gov/resources/works/2644983> <http://www.w3.org/1999/02/22-rdf-syntax-ns#type> <http://id.loc.gov/ontologies/bibframe/Work> .
<http://id.loc.gov/resources/works/2644983> <http://id.loc.gov/ontologies/bflc/aap> "Sideris, George Microelectronic packaging; interconnection and assembly of integrated circuits" .
<http://id.loc.gov/authorities/subjects/sh85084821> <http://id.loc.gov/ontologies/bflc/subjectOf> <http://id.loc.gov/resources/works/3870016> .
<http://id.loc.gov/resources/works/3870016> <http://www.w3.org/1999/02/22-rdf-syntax-ns#type> <http://id.loc.gov/ontologies/bibframe/Work> .
<http://id.loc.gov/resources/works/3870016> <http://id.loc.gov/ontologies/bflc/aap> "Soane, David S., 1951- Polymers in microelectronics" .
<http://id.loc.gov/authorities/subjects/sh85084821> <http://id.loc.gov/ontologies/bflc/subjectOf> <http://id.loc.gov/resources/works/12158838> .
<http://id.loc.gov/resources/works/12158838> <http://www.w3.org/1999/02/22-rdf-syntax-ns#type> <http://id.loc.gov/ontologies/bibframe/Work> .
<http://id.loc.gov/resources/works/12158838> <http://id.loc.gov/ontologies/bflc/aap> "Steinbruchel, Christoph Copper interconnect technology" .
<http://id.loc.gov/authorities/subjects/sh85084821> <http://id.loc.gov/ontologies/bflc/subjectOf> <http://id.loc.gov/resources/works/18174891> .
<http://id.loc.gov/resources/works/18174891> <http://www.w3.org/1999/02/22-rdf-syntax-ns#type> <http://id.loc.gov/ontologies/bibframe/Work> .
<http://id.loc.gov/resources/works/18174891> <http://id.loc.gov/ontologies/bflc/aap> "Sturdivant, Rick Microwave and millimeter-wave electronic packaging" .
<http://id.loc.gov/authorities/subjects/sh85084821> <http://id.loc.gov/ontologies/bflc/subjectOf> <http://id.loc.gov/resources/works/1089723> .
<http://id.loc.gov/resources/works/1089723> <http://www.w3.org/1999/02/22-rdf-syntax-ns#type> <http://id.loc.gov/ontologies/bibframe/Work> .
<http://id.loc.gov/resources/works/1089723> <http://id.loc.gov/ontologies/bflc/aap> "Thermal stress and strain in microelectronics packaging" .
<http://id.loc.gov/authorities/subjects/sh85084821> <http://id.loc.gov/ontologies/bflc/subjectOf> <http://id.loc.gov/resources/works/15260323> .
<http://id.loc.gov/resources/works/15260323> <http://www.w3.org/1999/02/22-rdf-syntax-ns#type> <http://id.loc.gov/ontologies/bibframe/Work> .
<http://id.loc.gov/resources/works/15260323> <http://id.loc.gov/ontologies/bflc/aap> "Tummala, Rao R., 1942- Introduction to system-on-package (SOP)" .
<http://id.loc.gov/authorities/subjects/sh85084821> <http://id.loc.gov/ontologies/bflc/subjectOf> <http://id.loc.gov/resources/works/12261638> .
<http://id.loc.gov/resources/works/12261638> <http://www.w3.org/1999/02/22-rdf-syntax-ns#type> <http://id.loc.gov/ontologies/bibframe/Work> .
<http://id.loc.gov/resources/works/12261638> <http://id.loc.gov/ontologies/bflc/aap> "Vardaman, Jan High-density microvia substrates" .
<http://id.loc.gov/authorities/subjects/sh85084821> <http://id.loc.gov/ontologies/bflc/subjectOf> <http://id.loc.gov/resources/works/12249679> .
<http://id.loc.gov/resources/works/12249679> <http://www.w3.org/1999/02/22-rdf-syntax-ns#type> <http://id.loc.gov/ontologies/bibframe/Work> .
<http://id.loc.gov/resources/works/12249679> <http://id.loc.gov/ontologies/bflc/aap> "Vardaman, Jan Worldwide developments in MCP integration" .
<http://id.loc.gov/authorities/subjects/sh85084821> <http://id.loc.gov/ontologies/bflc/subjectOf> <http://id.loc.gov/resources/works/12711559> .
<http://id.loc.gov/resources/works/12711559> <http://www.w3.org/1999/02/22-rdf-syntax-ns#type> <http://id.loc.gov/ontologies/bibframe/Work> .
<http://id.loc.gov/resources/works/12711559> <http://id.loc.gov/ontologies/bflc/aap> "Wartenberg, Scott A. RF measurements of die and packages" .
<http://id.loc.gov/authorities/subjects/sh85084821> <http://id.loc.gov/ontologies/bflc/subjectOf> <http://id.loc.gov/resources/works/22305232> .
<http://id.loc.gov/resources/works/22305232> <http://www.w3.org/1999/02/22-rdf-syntax-ns#type> <http://id.loc.gov/ontologies/bibframe/Work> .
<http://id.loc.gov/resources/works/22305232> <http://id.loc.gov/ontologies/bflc/aap> "Wide bandgap power semiconductor packaging" .
<http://id.loc.gov/authorities/subjects/sh85084821> <http://www.loc.gov/mads/rdf/v1#isMemberOfMADSScheme> <http://id.loc.gov/authorities/subjects> .
<http://id.loc.gov/authorities/subjects/sh85084821> <http://id.loc.gov/vocabulary/identifiers/lccn> "sh 85084821" .
<http://id.loc.gov/authorities/subjects/sh85084821> <http://www.w3.org/2002/07/owl#sameAs> <info:lc/authorities/sh85084821> .
<http://id.loc.gov/authorities/subjects/sh85084821> <http://www.w3.org/2002/07/owl#sameAs> <http://id.loc.gov/authorities/sh85084821#concept> .
<http://id.loc.gov/authorities/subjects/sh85084821> <http://www.loc.gov/mads/rdf/v1#adminMetadata> _:b371iddOtlocdOtgovauthoritiessubjectssh85084821 .
_:b371iddOtlocdOtgovauthoritiessubjectssh85084821 <http://www.w3.org/1999/02/22-rdf-syntax-ns#type> <http://id.loc.gov/ontologies/RecordInfo#RecordInfo> .
_:b371iddOtlocdOtgovauthoritiessubjectssh85084821 <http://id.loc.gov/ontologies/RecordInfo#recordChangeDate> "1986-02-11T00:00:00"^^<http://www.w3.org/2001/XMLSchema#dateTime> .
_:b371iddOtlocdOtgovauthoritiessubjectssh85084821 <http://id.loc.gov/ontologies/RecordInfo#recordStatus> "new"^^<http://www.w3.org/2001/XMLSchema#string> .
_:b371iddOtlocdOtgovauthoritiessubjectssh85084821 <http://id.loc.gov/ontologies/RecordInfo#recordContentSource> <http://id.loc.gov/vocabulary/organizations/dlc> .
<http://id.loc.gov/authorities/subjects/sh85084821> <http://www.loc.gov/mads/rdf/v1#adminMetadata> _:b378iddOtlocdOtgovauthoritiessubjectssh85084821 .
_:b378iddOtlocdOtgovauthoritiessubjectssh85084821 <http://www.w3.org/1999/02/22-rdf-syntax-ns#type> <http://id.loc.gov/ontologies/RecordInfo#RecordInfo> .
_:b378iddOtlocdOtgovauthoritiessubjectssh85084821 <http://id.loc.gov/ontologies/RecordInfo#recordChangeDate> "2004-04-26T08:23:53"^^<http://www.w3.org/2001/XMLSchema#dateTime> .
_:b378iddOtlocdOtgovauthoritiessubjectssh85084821 <http://id.loc.gov/ontologies/RecordInfo#recordStatus> "revised"^^<http://www.w3.org/2001/XMLSchema#string> .
_:b378iddOtlocdOtgovauthoritiessubjectssh85084821 <http://id.loc.gov/ontologies/RecordInfo#recordContentSource> <http://id.loc.gov/vocabulary/organizations/dlc> .
<http://id.loc.gov/authorities/subjects/sh85084821> <http://www.w3.org/1999/02/22-rdf-syntax-ns#type> <http://www.w3.org/2004/02/skos/core#Concept> .
<http://id.loc.gov/authorities/subjects/sh85084821> <http://www.w3.org/2004/02/skos/core#prefLabel> "Microelectronic packaging"@en .
<http://id.loc.gov/authorities/subjects/sh85084821> <http://www.w3.org/2008/05/skos-xl#altLabel> _:b388iddOtlocdOtgovauthoritiessubjectssh85084821 .
_:b388iddOtlocdOtgovauthoritiessubjectssh85084821 <http://www.w3.org/1999/02/22-rdf-syntax-ns#type> <http://www.w3.org/2008/05/skos-xl#Label> .
_:b388iddOtlocdOtgovauthoritiessubjectssh85084821 <http://www.w3.org/2008/05/skos-xl#literalForm> "Packaging (Microelectronics)"@en .
<http://id.loc.gov/authorities/subjects/sh85084821> <http://www.w3.org/2004/02/skos/core#broader> <http://id.loc.gov/authorities/subjects/sh85084822> .
<http://id.loc.gov/authorities/subjects/sh85084822> <http://www.w3.org/1999/02/22-rdf-syntax-ns#type> <http://www.w3.org/2004/02/skos/core#Concept> .
<http://id.loc.gov/authorities/subjects/sh85084822> <http://www.w3.org/2004/02/skos/core#prefLabel> "Microelectronics"@en .
<http://id.loc.gov/authorities/subjects/sh85084821> <http://www.w3.org/2004/02/skos/core#broader> <http://id.loc.gov/authorities/subjects/sh85042366> .
<http://id.loc.gov/authorities/subjects/sh85042366> <http://www.w3.org/1999/02/22-rdf-syntax-ns#type> <http://www.w3.org/2004/02/skos/core#Concept> .
<http://id.loc.gov/authorities/subjects/sh85042366> <http://www.w3.org/2004/02/skos/core#prefLabel> "Electronic packaging"@en .
<http://id.loc.gov/authorities/subjects/sh85084821> <http://www.w3.org/2004/02/skos/core#narrower> <http://id.loc.gov/authorities/subjects/sh92002333> .
<http://id.loc.gov/authorities/subjects/sh92002333> <http://www.w3.org/1999/02/22-rdf-syntax-ns#type> <http://www.w3.org/2004/02/skos/core#Concept> .
<http://id.loc.gov/authorities/subjects/sh92002333> <http://www.w3.org/2004/02/skos/core#prefLabel> "Multichip modules (Microelectronics)"@en .
<http://id.loc.gov/authorities/subjects/sh85084821> <http://www.w3.org/2004/02/skos/core#closeMatch> <http://data.bnf.fr/ark:/12148/cb124308557> .
<http://data.bnf.fr/ark:/12148/cb124308557> <http://www.w3.org/1999/02/22-rdf-syntax-ns#type> <http://www.w3.org/2004/02/skos/core#Concept> .
<http://data.bnf.fr/ark:/12148/cb124308557> <http://www.w3.org/2004/02/skos/core#prefLabel> "Mise sous boîtier (microélectronique)"@fr .
<http://id.loc.gov/authorities/subjects/sh85084821> <http://www.w3.org/2004/02/skos/core#closeMatch> <https://d-nb.info/gnd/4206597-5> .
<https://d-nb.info/gnd/4206597-5> <http://www.w3.org/1999/02/22-rdf-syntax-ns#type> <http://www.w3.org/2004/02/skos/core#Concept> .
<https://d-nb.info/gnd/4206597-5> <http://www.w3.org/2004/02/skos/core#prefLabel> "Mikrofügen" .
<http://id.loc.gov/authorities/subjects/sh85084821> <http://www.w3.org/2004/02/skos/core#closeMatch> <https://d-nb.info/gnd/4143472-9> .
<https://d-nb.info/gnd/4143472-9> <http://www.w3.org/1999/02/22-rdf-syntax-ns#type> <http://www.w3.org/2004/02/skos/core#Concept> .
<https://d-nb.info/gnd/4143472-9> <http://www.w3.org/2004/02/skos/core#prefLabel> "Halbleitergehäuse" .
<http://id.loc.gov/authorities/subjects/sh85084821> <http://www.w3.org/2004/02/skos/core#closeMatch> <http://www.wikidata.org/entity/Q17152858> .
<http://www.wikidata.org/entity/Q17152858> <http://www.w3.org/1999/02/22-rdf-syntax-ns#type> <http://www.w3.org/2004/02/skos/core#Concept> .
<http://www.wikidata.org/entity/Q17152858> <http://www.w3.org/2004/02/skos/core#prefLabel> "semiconductor package" .
<http://id.loc.gov/authorities/subjects/sh85084821> <http://www.w3.org/2004/02/skos/core#closeMatch> <http://id.worldcat.org/fast/1019751> .
<http://id.worldcat.org/fast/1019751> <http://www.w3.org/1999/02/22-rdf-syntax-ns#type> <http://www.w3.org/2004/02/skos/core#Concept> .
<http://id.worldcat.org/fast/1019751> <http://www.w3.org/2004/02/skos/core#prefLabel> "Microelectronic packaging" .
<http://id.loc.gov/authorities/subjects/sh85084821> <http://www.w3.org/2004/02/skos/core#narrowMatch> <http://id.worldcat.org/fast/1019756> .
<http://id.worldcat.org/fast/1019756> <http://www.w3.org/1999/02/22-rdf-syntax-ns#type> <http://www.w3.org/2004/02/skos/core#Concept> .
<http://id.worldcat.org/fast/1019756> <http://www.w3.org/2004/02/skos/core#prefLabel> "Microelectronic packaging--Reliability" .
<http://id.loc.gov/authorities/subjects/sh85084821> <http://www.w3.org/2004/02/skos/core#narrowMatch> <http://id.worldcat.org/fast/1019755> .
<http://id.worldcat.org/fast/1019755> <http://www.w3.org/1999/02/22-rdf-syntax-ns#type> <http://www.w3.org/2004/02/skos/core#Concept> .
<http://id.worldcat.org/fast/1019755> <http://www.w3.org/2004/02/skos/core#prefLabel> "Microelectronic packaging--Mathematical models" .
<http://id.loc.gov/authorities/subjects/sh85084821> <http://www.w3.org/2004/02/skos/core#narrowMatch> <http://id.worldcat.org/fast/1019752> .
<http://id.worldcat.org/fast/1019752> <http://www.w3.org/1999/02/22-rdf-syntax-ns#type> <http://www.w3.org/2004/02/skos/core#Concept> .
<http://id.worldcat.org/fast/1019752> <http://www.w3.org/2004/02/skos/core#prefLabel> "Microelectronic packaging--Costs" .
<http://id.loc.gov/authorities/subjects/sh85084821> <http://www.w3.org/2004/02/skos/core#narrowMatch> <http://id.worldcat.org/fast/1019754> .
<http://id.worldcat.org/fast/1019754> <http://www.w3.org/1999/02/22-rdf-syntax-ns#type> <http://www.w3.org/2004/02/skos/core#Concept> .
<http://id.worldcat.org/fast/1019754> <http://www.w3.org/2004/02/skos/core#prefLabel> "Microelectronic packaging--Materials" .
<http://id.loc.gov/authorities/subjects/sh85084821> <http://www.w3.org/2004/02/skos/core#narrowMatch> <http://id.worldcat.org/fast/1019753> .
<http://id.worldcat.org/fast/1019753> <http://www.w3.org/1999/02/22-rdf-syntax-ns#type> <http://www.w3.org/2004/02/skos/core#Concept> .
<http://id.worldcat.org/fast/1019753> <http://www.w3.org/2004/02/skos/core#prefLabel> "Microelectronic packaging--Design and construction" .
<http://id.loc.gov/authorities/subjects/sh85084821> <http://www.w3.org/2004/02/skos/core#inScheme> <http://id.loc.gov/authorities/subjects> .
<http://id.loc.gov/authorities/subjects/sh85084821> <http://www.w3.org/2004/02/skos/core#altLabel> "Packaging (Microelectronics)"@en .
<http://id.loc.gov/authorities/subjects/sh85084821> <http://www.w3.org/2004/02/skos/core#changeNote> _:b461iddOtlocdOtgovauthoritiessubjectssh85084821 .
_:b461iddOtlocdOtgovauthoritiessubjectssh85084821 <http://www.w3.org/1999/02/22-rdf-syntax-ns#type> <http://purl.org/vocab/changeset/schema#ChangeSet> .
_:b461iddOtlocdOtgovauthoritiessubjectssh85084821 <http://purl.org/vocab/changeset/schema#subjectOfChange> <http://id.loc.gov/authorities/subjects/sh85084821> .
_:b461iddOtlocdOtgovauthoritiessubjectssh85084821 <http://purl.org/vocab/changeset/schema#creatorName> <http://id.loc.gov/vocabulary/organizations/dlc> .
_:b461iddOtlocdOtgovauthoritiessubjectssh85084821 <http://purl.org/vocab/changeset/schema#createdDate> "1986-02-11T00:00:00"^^<http://www.w3.org/2001/XMLSchema#dateTime> .
_:b461iddOtlocdOtgovauthoritiessubjectssh85084821 <http://purl.org/vocab/changeset/schema#changeReason> "new"^^<http://www.w3.org/2001/XMLSchema#string> .
<http://id.loc.gov/authorities/subjects/sh85084821> <http://www.w3.org/2004/02/skos/core#changeNote> _:b469iddOtlocdOtgovauthoritiessubjectssh85084821 .
_:b469iddOtlocdOtgovauthoritiessubjectssh85084821 <http://www.w3.org/1999/02/22-rdf-syntax-ns#type> <http://purl.org/vocab/changeset/schema#ChangeSet> .
_:b469iddOtlocdOtgovauthoritiessubjectssh85084821 <http://purl.org/vocab/changeset/schema#subjectOfChange> <http://id.loc.gov/authorities/subjects/sh85084821> .
_:b469iddOtlocdOtgovauthoritiessubjectssh85084821 <http://purl.org/vocab/changeset/schema#creatorName> <http://id.loc.gov/vocabulary/organizations/dlc> .
_:b469iddOtlocdOtgovauthoritiessubjectssh85084821 <http://purl.org/vocab/changeset/schema#createdDate> "2004-04-26T08:23:53"^^<http://www.w3.org/2001/XMLSchema#dateTime> .
_:b469iddOtlocdOtgovauthoritiessubjectssh85084821 <http://purl.org/vocab/changeset/schema#changeReason> "revised"^^<http://www.w3.org/2001/XMLSchema#string> .