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	Label	Dataset	Type	Identifier
1.	Ball grid array technology	LC Classification (LCC)	ClassNumber Topic	TK7870.16
	Technology--Electrical engineering. Electronics. Nuclear engineering--Electronics--Apparatus and materials--Electronic packaging--Ball grid array technology ; Ball grid array technology--Electronic packaging
2.	Tegehall, P. E. Impact of cracking beneath solder pads in printed board laminate on reliability of solder joints to ceramic ball grid array packages Noordwijk: ESA Publications Division; c2003	BIBFRAME Instances	Instance	13388381

3.	Wickham, M. (Martin) An investigation into ball grid array inspection techniques Noordwijk, the Netherlands: ESA Publications Division; c1999	BIBFRAME Instances	Instance	11905181

4.	Lau, John H. Ball grid array technology New York: McGraw-Hill; c1995	BIBFRAME Instances	Instance	4907899

5.	Tegehall, P. E. Impact of cracking beneath solder pads in printed board laminate on reliability of solder joints to ceramic ball grid array packages	BIBFRAME Works	Work Text Monograph	13388381

6.	An investigation into ball grid array inspection techniques	BIBFRAME Works	Work Text Monograph	11905181

7.	Ball grid array technology	BIBFRAME Works	Work Text Monograph	4907899

8.	BGA/CSP development update service	BIBFRAME Works	Work Text Serial	14294295

9.	BGA development update service	BIBFRAME Works	Work Text Serial	12254189

10.	Ball grid array technology	LC Subject Headings (LCSH)	Topic SimpleType Authority	sh94006999
	BGA (Printed circuits)

Results: 1-10 of 10