Label | Dataset | Type | Subdivision | Identifier | |
---|---|---|---|---|---|
1. | Tegehall, P. E. Impact of cracking beneath solder pads in printed board laminate on reliability of solder joints to ceramic ball grid array packages Noordwijk: ESA Publications Division; c2003 |
BIBFRAME Instances |
Instance | 13388381 | |
2. | Madenci, Erdogan Fatigue life prediction of solder joints in electronic packages with ANSYS Boston, Mass: Kluwer Academic Publishers; 2002 |
BIBFRAME Instances |
Instance | 12959294 | |
3. | Tegehall, P. E. Impact of cracking beneath solder pads in printed board laminate on reliability of solder joints to ceramic ball grid array packages |
BIBFRAME Works |
Work Text Monograph |
13388381 | |
4. | Madenci, Erdogan Fatigue life prediction of solder joints in electronic packages with ANSYS |
BIBFRAME Works |
Work Text Monograph |
12959294 | |
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