Wire bonding (Electronic packaging)
- Here are entered works on processes used to connect package leads to an integrated circuit.
URI(s)
Variants
Broader Terms
Closely Matching Concepts from Other Schemes
Broader Concepts from Other Schemes
Sources
found: Work cat.: Harman, G.G. Wire bonding in microelectronics, 1997:CIP introd (primarily concerned with ... chip-to-package wire bonds ...)
found: ASTI on FirstSearch, May 19, 1997(subject term: Wire bonding)
found: INSPEC on FirstSearch, May 19, 1997(in title: Wirebonding, descriptor term: lead bonding)
found: Electronics engineers' handbook, c1990:pp. 8-79 (lead bonding)
notfound: Encyc. of electronics, 1990;The new IEEE standard dict. of electrical and electronics terms, 1992
General Notes
- Here are entered works on processes used to connect package leads to an integrated circuit.
Instance Of
Scheme Membership(s)
Collection Membership(s)
Change Notes
1997-05-19: new
1997-06-26: revised
Alternate Formats
