Bibframe Instance

Title

Investigations on Microstructure and Mechanical Properties of the Cu/Pb-free Solder Joint Interfaces

Identified By

Local: 978-3-662-48823-2

Lccn: 2019749321

Isbn: 9783662488232

Doi: 10.1007/978-3-662-48823-2

Note

description source: Description based on publisher-supplied MARC data

Extent

1 online resource (XV, 143 pages 115 illustrations, 81 illustrations in color.)

Digital Characteristic(s)

FileType: text file

EncodingFormat: PDF file

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Provision Activity

Publication: Germany 2016

Publication: Berlin, Heidelberg: Springer Berlin Heidelberg, Imprint: Springer, 2016

Responsibility Statement

by Qingke Zhang

Media

computer

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Issuance

single unit

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Carrier

online resource

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Edition Statement

1st ed. 2016.

Admin Metadata

Status: new

Date: 2015-10-31

Agent: United States, Library of Congress

Admin Metadata

Status: changed

Date: 2020-09-28T16:39:42

Admin Metadata

Generation Process: https://github.com/lcnetdev/marc2bibframe2/releases/tag/v2.7.0

Status: changed

Date: 2024-08-02T19:01:00.764185-04:00

Agent: United States, Library of Congress, Network Development and MARC Standards Office

Admin Metadata

Encoding Level: preliminary

Description Level: http://id.loc.gov/ontologies/bibframe-2-3-0/

Description Conventions: ISBD: International standard bibliographic descriptionProvider-neutral e-resource MARC record guidelinesResource description and access

Identified By: bf:Local, 21683099

Description Language: English

Bibframe Instance

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