Bibframe Instance

Title

Microelectronic interconnects and packaging, optical and electrical technologies

Identified By

Isbn: 081940456X

Supplementary Content

Includes bibliographical references and index.

Note

Physical details: ill.

Papers from the International Symposium on Advances in Interconnection and Packaging, held 5-9 Nov. 1990, in Boston, Mass.

Dimensions

28 cm.

Extent

x, 674 p.

Provision Activity

Publication: Bellingham, Wash., USA: SPIE; c1991

Responsibility Statement

Gnanalingam Arjavalingam, James Pazaris, conference chairs/editors

Media

Issuance

Admin Metadata

Generation Process: DLC marc2bibframe2 v2.5.0

Status: new

Encoding Level: full

Identified By: bf:Local, 2472351

Change Date: 1992-01-06T15:19:30

Creation Date: 1990-11-30

Assigner: United States, Library of Congress