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  Label Dataset Type Subdivision Identifier
61. [Trademark registration by E. L. Parker & Co. for Ideal brand Tin Plates, Terne Plates, Tin Taggers, Black Taggers, Sheet Metal, Sheet Iron, Solder, Cement, Paint, and Paper] 1896 July 21

 BIBFRAME Instances
 Instance 23288825
62. Lee, Tae-Kyu Fundamentals of Lead-Free Solder Interconnect Technology New York, NY: Springer US, Imprint: Springer; 2015

 BIBFRAME Instances
 Instance 21665127
63. American Standards Association. Sectional Committee on the Standardization of Pipe Flanges and Flanged Fittings, B16. American standard cast bronze solder-joint pressure fittings New York: American Society of Mechanical Engineers; [1963]

 BIBFRAME Instances
 Instance 6578777
64. Lin, Kwang-lung Solder materials Singapore: World Scientific Publishing Co. Pte. Ltd.; [2018]

 BIBFRAME Instances
 Instance 20729737
65. Lasansky, Jeannette To cut, piece, and solder Lewisburg, Pa: Oral Traditions Project; c1982

 BIBFRAME Instances
 Instance 442730
66. Hwang, Jennie S. Solder paste in electronics packaging New York: Van Nostrand Reinhold; c1989

 BIBFRAME Instances
 Instance 1021438
67. Suhir, Ephraim Avoiding inelastic strains in solder joint interconnections of IC devices Boca Raton, FL: CRC Press; 2020

 BIBFRAME Instances
 Instance 21593189
68. Collins, Marjory, 1912-1985 New York, New York. Industrial training for war work offered to women by New York University under United States Government sponsorship. Teaching women to weld and solder 1943 Feb

 BIBFRAME Instances
 Instance 20019409
69. United States. Office of Scientific Research and Development. National Defense Research Committee. A gold-copper alloy solder. (Report No. 931-13.) [United States]: [Office of Scientific Research and Development, National Defense Research Committee, Division 15-Radio Coordination]; 05-30-1944

 BIBFRAME Instances
 Instance 21779492
70. Institute for Interconnecting and Packaging Electronic Circuits (Northbrook, Ill.) Surface mount solder joint evaluation Northbrook, IL: IPC, Institute for Interconnecting and Packaging Electronic Circuits; c1998

 BIBFRAME Instances
 Instance 11946604
71. Tu, K. N. (King-ning), 1937- Solder joint technology New York: Springer; c2007

 BIBFRAME Instances
 Instance 14699925
72. Solder, Cheo Jeffery allen One4 de brovahs Boston, MA: Trilingual Press; 2012

 BIBFRAME Instances
 Instance 17262965
73. Collins, Marjory, 1912-1985 New York, New York. Industrial training for war work offered to women by New York University under United States Government sponsorship. Teaching women to weld and solder 1943 Feb

 BIBFRAME Instances
 Instance 20079445
74. Lau, John H. Solder joint reliability of BGA, CSP, flip chip, and fine pitch SMT assemblies New York: McGraw-Hill; c1997

 BIBFRAME Instances
 Instance 2580313
75. Madenci, Erdogan Fatigue life prediction of solder joints in electronic packages with ANSYS Boston, Mass: Kluwer Academic Publishers; 2002

 BIBFRAME Instances
 Instance 12959294
76. Lau, John H. Solder joint reliability New York: Van Nostrand Reinhold; c1991

 BIBFRAME Instances
 Instance 580034
77. Prasad, Bhagwati Tinker.solder.tap Delhi: Sarai Programme, Centre for the Study of Developing Societies; 2009

 BIBFRAME Instances
 Instance 16672388
78. British Engineering Standards Association British standard specification for brazing solder (grades A and B) London: Pub. for the Association by C. Lockwood & son; 1926

 BIBFRAME Instances
 Instance 7799673
79. Solder Symposium, New York, 1962 Papers on soldering, 1962, presented at the Sixty-fifth Annual Meeting, American Society for Testing and Materials, New York, N. Y., June 24, 1962 Philadelphia: American Society for Testing and Materials; [1963]

 BIBFRAME Instances
 Instance 6104444
80. [Trademark registration by E. L. Parker & Co. for Model. brand All Sheet Metal and Solder] 1892 Dec. 6.

 BIBFRAME Instances
 Instance 23005312


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